Electronic device, electronic apparatus, and moving object

ABSTRACT

An electronic device includes a resonator provided with a heating element, and a circuit component opposed to the heating element, and provided with at least an oscillating amplifier element, and a distance between the heating element and the circuit component is in a range not smaller than 0 mm and no larger than 1.5 mm.

BACKGROUND

1. Technical Field

The present invention relates to an electronic device, and an electronicapparatus and a moving object each equipped with the electronic device.

2. Related Art

In the past, further miniaturization and height reduction of anelectronic device including a resonation device such as a quartz crystalresonator has been demanded due to miniaturization and height reductionof an electronic apparatus, and at the same time, reduction of the powerconsumption has also been demanded in order for achieving energy saving.In particular, the electronic device such as an oven controlled crystaloscillator (OCXO), which includes a thermostatic oven for heating thequartz crystal resonator with a heating element to keep the ambienttemperature of the quartz crystal resonator constant in order to avoidan influence of the ambient temperature to obtain high frequencystability, has a problem that the power consumption is high since theheat from the heating element is transferred to a substrate, and isradiated to the outside of the OCXO.

In order to solve such a problem, in JP-A-7-50523, there is disclosed amethod in which there is adopted a structure of supporting a substrateprovided with the quartz crystal resonator attached with the heatingelement in a state of being separated from a case base using a supportmember, and a foil-like heat-insulating material is partially attachedin a scattered manner on a surface of a case for covering theseconstituents, and thus, the heat to be radiated outside from the case issuppressed to achieve the reduction of power consumption.

Further, in JP-A-2009-200817, there is disclosed a method in which thereis adopted in a substrate provided with the quartz crystal resonator astructure of disposing a heating film resistor and atemperature-sensitive film resistor on an upper surface of the substratehaving a surface opposed to the lower surface of the quartz crystalresonator, and supporting the substrate in a state being separated fromthe case base using a support member, and the followability of theoperating temperature with respect to the external temperature variationis enhanced, and the heat radiated outside from the case is suppressedto achieve the reduction of power consumption.

However, since the OCXO described above does not keep the ambienttemperature of the oscillator circuit for oscillating the quartz crystalresonator constant with respect to the external temperature variation,there is a problem that the frequency stability is deteriorated due tothe temperature characteristics provided to the oscillator circuit.

SUMMARY

An advantage of some aspects of the invention is to solve at least apart of the problems described above, and the invention can beimplemented as the following forms or application examples.

Application Example 1

This application example is directed to an electronic device including aresonator provided with a heating element, and a circuit componentopposed to the heating element, and provided with at least anoscillating amplifier element, and a distance between the heatingelement and the circuit component is in a range not smaller than 0 mmand no larger than 1.5 mm.

According to this application example, since the heating elementprovided to the resonator and the circuit component provided with theoscillating amplifier element are disposed so as to be opposed to eachother, and the distance between the heating element and the circuitcomponent is set to a value within the range not smaller than 0 mm andno larger than 1.5 mm, and thus, the oscillating amplifier elementprovided to the circuit component is kept at constant temperature due tothe heat transfer and the radiation heat from the heating element, thevariation in oscillation frequency of the resonator caused by thetemperature characteristics provided to the oscillating amplifierelement can be suppressed to a low level, and thus there is an advantagethat the frequency stability of the electronic device can further beimproved.

Application Example 2

This application example is directed to the electronic device accordingto the application example described above, wherein the distance betweenthe heating element and the circuit component is in a range not smallerthan 0 mm and no larger than 1.2 mm.

According to this application example, since the distance between theheating element and the circuit component is set to a value within therange not smaller than 0 mm and no larger than 1.2 mm, and thus, theoscillating amplifier element provided to the circuit component is keptat constant temperature due to the heat transfer and the radiation heatfrom the heating element, the variation in oscillation frequency of theresonator due to the temperature characteristics provided to theoscillating amplifier element can be suppressed to a low level, and thusthere is an advantage that the frequency stability of the electronicdevice can further be improved. Further, by setting the distance to avalue within the smaller range of no larger than 1.2 mm, the efficiencyof the heat transfer is improved, and there is an advantage that thecurrent consumption for keeping the oscillating amplifier element atconstant temperature can be suppressed to a low level.

Application Example 3

This application example is directed to the electronic device accordingto the application example described above, wherein the distance betweenthe heating element and the circuit component is in a range not smallerthan 0.1 mm and no larger than 0.8 mm.

According to this application example, since the oscillating amplifierelement provided to the circuit component can more efficiently receivethe radiation heat from the heating element by setting the distancebetween the heating element and the circuit component to a value withinthe range not smaller than 0.1 mm and no larger than 0.8 mm, theoscillating amplifier element can further be kept at constanttemperature. Therefore, since the variation in the oscillation frequencydue to the temperature characteristics provided to the oscillatingamplifier element can be suppressed to a lower level, and at the sametime, the current consumption for keeping the oscillating amplifierelement at constant temperature can be suppressed to a low level, thereis an advantage that the frequency stability of the electronic devicecan further be improved, and at the same time, the current consumptioncan further be reduced.

Application Example 4

This application example is directed to the electronic device accordingto the application example described above, wherein the heating elementcovers the circuit component in a plan view.

According to this application example, since the circuit component iscovered by the heating element in the plan view, and thus, the heat ofthe heating element can efficiently be transferred to the circuitcomponent, the temperature of the circuit component can further be keptconstant, and there is an advantage that the frequency stability of theelectronic device can further be improved.

Application Example 5

This application example is directed to the electronic device accordingto the application example described above, wherein the circuitcomponent is provided with at least an inductor and a variablecapacitance element.

According to this application example, since the inductor and thevariable capacitance element, which are large in variation in theconstant value with the variation in the ambient temperature, can bekept at constant temperature by disposing the circuit componentincluding the inductor and the variable capacitance element close to theheating element, there is an advantage that it is possible to furtherstabilize the temperature characteristics of the oscillator circuit foroscillating the resonator to thereby further improve the frequencystability of the electronic device.

Application Examples 6, 7, and 8

These application examples are directed to the electronic deviceaccording to the application example described above, wherein theelectronic device further includes a first support section disposed onthe resonator, a substrate having the circuit component disposed, andprovided with a second support section, and a package housing theresonator and the substrate, the first support section is connected tothe substrate, and the second support section is connected to thepackage.

According to these application examples, since the resonator providedwith the heating element and the substrate provided with the circuitcomponent including the oscillating amplifier element are set to a stateseparated from the base substrate of the package using the secondsupport section, it is possible to reduce the heat of the heatingelement transferred to the outside through the base substrate of thepackage to thereby effectively use the heat of the heating element.Therefore, it becomes possible to reduce the current consumption, andthus, there is an advantage that the electronic device with low powerconsumption can be obtained.

Application Example 9

This application example is directed to an electronic apparatusincluding the electronic device according to the application exampledescribed above.

According to this application example, there is an advantage that theelectronic apparatus provided with the electronic device superior infrequency stability and low in power consumption can be obtained.

Application Example 10

This application example is directed to a moving object including theelectronic device according to the application example described above.

According to this application example, there is an advantage that themoving object provided with the electronic device superior in frequencystability and low in power consumption can be configured.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIGS. 1A and 1B are schematic configuration diagrams of an electronicdevice according to an embodiment of the invention, wherein FIG. 1A is aschematic plan view showing the inside of the electronic device, andFIG. 1B is a cross-sectional view along the A-A line.

FIG. 2 is a block diagram showing a circuit configuration of theelectronic device according to the embodiment of the invention.

FIG. 3 is a diagram showing a temperature variation of a heating elementand a resonator with respect to the distance between the heating elementand a circuit component of the electronic device according to theembodiment of the invention.

FIG. 4 is a diagram showing a temperature variation of the circuitcomponent with respect to the distance between the heating element andthe circuit component of the electronic device according to theembodiment of the invention.

FIGS. 5A through 5C are diagrams showing the temperature characteristicswith respect to the distance between the heating element and the circuitcomponent of the electronic device according to the embodiment of theinvention, wherein. FIG. 5A shows the case in which the distance is 0mm, FIG. 5B shows the case in which the distance is 0.5 mm, and FIG. 5Cshows the case in which the distance is 1.5 mm.

FIG. 6 is a diagram showing a current consumption with respect to thedistance between the heating element and the circuit component of theelectronic device according to the embodiment of the invention.

FIG. 7 is a perspective view showing a configuration of a mobile type(or a laptop type) personal computer as an electronic apparatus equippedwith the electronic device according to the invention.

FIG. 8 is a perspective view showing a configuration of a cellular phone(including PHS) as an electronic apparatus equipped with the electronicdevice according to the invention.

FIG. 9 is a perspective view showing a configuration of a digital cameraas an electronic apparatus equipped with the electronic device accordingto the invention.

FIG. 10 is a perspective view showing a configuration of a vehicle as amoving object equipped with the electronic device according to theinvention.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Some embodiments of the invention will hereinafter be explained indetail with reference to the accompanying drawings.

Electronic Device

FIGS. 1A and 1B are schematic configuration diagrams of the electronicdevice according to the embodiment of the invention, wherein FIG. 1A isa schematic plan view showing the inside of the electronic device, andFIG. 1B is a cross-sectional view along the A-A line in FIG. 1A.Further, FIG. 2 is a block diagram showing a circuit configuration ofthe electronic device according to the embodiment of the invention. Itshould be noted that in FIG. 1A, there is shown the state of removing anupper part of a cover 34 for the sake of convenience of explanation ofan internal configuration of the electronic device 1.

The electronic device 1 shown in FIGS. 1A and 1B is configured includinga resonator 10 provided with a heating element 12, a substrate 14provided with a circuit component 16, first support sections 20connected to the substrate 14 and for supporting the resonator 10,second support sections 22 connected to a base substrate 32 of a package30 and for supporting the substrate 14, and the package 30.

The resonator 10 has a vibrating element installed inside a package madeof ceramic or the like. Further, the inside of the package of theresonator 10 is airtightly sealed in a reduced-pressure atmosphere or anatmosphere with an inert gas such as nitrogen.

On one principal surface of the resonator 10, there are fixed theheating element 12 and one end portions of the first support sections 20with a bonding material such as solder, metal bumps, or anelectrically-conductive adhesive.

On one principal surface of the substrate 14, there are fixed thecircuit component 16 including an oscillating amplifier element, and theother end portions of the first support sections 20 for supporting theresonator 10 with a bonding material such as solder, metal bumps, or anelectrically-conductive adhesive, and the heating element 12 fixed tothe resonator 10 and the circuit component 16 fixed to the substrate 14are disposed so as to be opposed to each other. Further, on the otherprincipal surface of the substrate 14, there are fixed one end portionsof the second support sections 22 with a bonding material such assolder, metal bumps, or an electrically-conductive adhesive.

As shown in FIG. 1B, in the electronic device 1, since the heatingelement 12 and the circuit component 16 are disposed so as to be opposedto each other with a distance H, and are disposed so that the heatingelement 12 covers the circuit component 16, it becomes easy for the heatof the heating element 12 for heating the resonator 10 to efficiently betransferred by radiation, and thus, the circuit component 16 includingthe oscillating amplifier element having the temperature characteristicscan be kept at constant temperature. Therefore, it is possible toprevent deterioration of the frequency stability due to thecharacteristic variation of the oscillating amplifier element generatedby the variation in the ambient temperature of the package 30, and thus,the electronic device 1 having superior frequency stability can beobtained.

The package 30 is composed of the base substrate 32 and the cover 34,and on one principal surface of the base substrate 32, there are fixedthe other end portions of the second support sections 22 for supportingthe substrate 14 with a bonding material such as solder, metal bumps, oran electrically-conductive adhesive. According to such a structure asdescribed above, since the resonator 10 provided with the heatingelement 12 and the substrate 14 provided with the circuit component 16including the oscillating amplifier element are set to a state separatedfrom the base substrate 32 of the package 30 using the second supportsections 22, it is possible to reduce the heat of the heating element 12transferred to the outside through the base substrate 32 of the package30 to thereby effectively use the heat of the heating element 12.Therefore, it becomes possible to reduce the current consumption, andthus, the electronic device 1 with low power consumption can beobtained.

The cover 34 covers the resonator 10 and the substrate 14, and is bondedto the base substrate 32. The inside of the package 30 covered by thecover 34 and the base substrate 32 is sealed for preventing the heatfrom being released due to inflow and outflow of the gas. It should benoted that the inside of the package 30 can be sealed in areduced-pressure atmosphere such as vacuum in order to prevent the heatfrom being released due to the thermal transfer by the gas. Further, thepositions of the second support sections 22 fixed to the substrate 14are preferably arranged as distantly as possible from the positions ofthe first support sections 20 fixed to the substrate 14 in order toreduce the heat transfer through the substrate 14.

It should be noted that in the explanation of the electronic deviceaccording to the embodiment of the invention, there is omitted thegraphic description of the other circuit components disposed on theprincipal surface of the resonator 10, both of the principal surfaces ofthe substrate 14, and the principal surface of the base substrate 32such as a control circuit for the heating element 12 or the oscillatorcircuit for the resonator 10.

The substrate 14 and the base substrate 14 are formed of a materialhaving an insulating property such as ceramics or glass epoxy. Further,the electrodes and terminals, and electrode wiring and throughelectrodes for electrically connecting these electrodes and terminalsprovided to the substrate 14 and the base substrate 32 are typicallyformed using a method of printing a metal material such as tungsten (W)or molybdenum (Mo) on the substrate by screen printing, calcining thematerial, and then performing plating of nickel (Ni), gold (Au), or thelike on the material, or a method of etching a substrate provided with acopper foil on the entire surface.

The first support sections 20 and the second support sections 22 areeach formed of a metal material such as copper (Cu) or an alloy of iron(Fe) and nickel (Ni). By using the metal material having a high thermalconductivity such as copper (Cu) for the first support sections 20, theheat of the heating element 12 is transferred to the circuit component16 not only by the radiation but also from the resonator 10 through thefirst support sections 20 and the substrate 14. Therefore, thetemperature of the circuit component 16 can further be kept constant.Further, by using a metal material having a poor thermal conductivitysuch as 42alloy, which is an alloy of iron (Fe) combined with nickel(Ni), for the second support sections 22, the heat of the resonator 10and the substrate 14 can be prevented from being transferred to the basesubstrate 32, and thus, the temperature of the resonator 10 and thecircuit component 16 can further be kept constant.

The cover 34 can be made of a ceramics material, which is the samematerial as that of the substrate 14, besides the metal material such askovar. It should be noted that in the case of the metal material, ashield effect is obtained, which is advantageous in preventing anexternal electrical influence.

Then, a circuit configuration of the electronic device according to theembodiment of the invention will be explained.

As shown in FIG. 2, the circuit of the electronic device 1 isconstituted by an oscillator circuit section 40 for oscillating theresonator 10, an amplifier circuit section 46 for amplifying anoscillating signal, a control circuit section 50 for controlling theheating element 12 for keeping the temperature of the resonatorconstant, and so on.

The oscillator circuit section 40 is constituted by a load capacitance42 including a variable capacitance element necessary for theoscillation, the circuit component 16 including the amplifier elementeasily affected by the temperature variation, a filter circuit 44including an inductor for suppressing a fundamental mode of thevibrating element and making it easy to oscillate in an overtone mode,and so on.

It should be noted that since the variable capacitance element of theload capacitance 42 and the inductor of the filter circuit 44 each havea large variation in constant value due to the variation in ambienttemperature, by disposing the variable capacitance element and theinductor in the vicinity of the heating element 12 similarly to theoscillating amplifier element, the variable capacitance element and theinductor can be kept at constant temperature, and thus, it is possibleto further stabilize the temperature characteristics of the oscillatorcircuit for oscillating the resonator 10 to thereby further improve thefrequency stability of the electronic device 1.

The control circuit section 50 controls the heating element 12 fixed tothe resonator 10 based on the temperature information of athermo-sensitive element 52 disposed in the vicinity of the resonator 10to keep the resonator 10 at constant temperature. A heater, a powertransistor, or the like is used as the heating element 12, and athermistor, a temperature-sensing quartz crystal resonator, or the likeis used as the thermo-sensitive element 52.

Then, the influences of the distance H between the heating element 12and the circuit component 16 in the electronic device 1 according to theembodiment of the invention on the various characteristics of theelectronic device 1 will be explained based on the measurement results.

FIG. 3 is a diagram showing a temperature variation of the heatingelement and the resonator with respect to the distance between theheating element and the circuit component of the electronic deviceaccording to the embodiment of the invention. In the drawing, thesurface temperature of the heating element 12 and the resonator 10 ismeasured while varying the ambient temperature of the electronic device1 from −40° C. to 80° C., and there is shown how the difference ΔT1between the highest temperature and the lowest temperature of theheating element 12 and the resonator 10 varies in the case of varyingthe distance H between the heating element 12 and the circuit component16.

According to FIG. 3, in the case in which the distance H between theheating element 12 and the circuit component 16 is 0 mm, namely theheating element 12 and the circuit component 16 have contact with eachother, ΔT1 is around 2° C., but in the case in which the distance H isequal to or larger than 0.1 mm, there is shown a tendency that ΔT1 isapproximately constant at around 1.6° C. It is conceivable that in thecase in which the heating element 12 and the circuit component 16 havecontact with each other, the heat of the heating element 12 istransferred to the circuit component 16 to thereby absorb the heat forheating the resonator 10, and thus, ΔT1 is increased. Therefore, it isadvantageous to set the distance H to be equal to or larger than 0.1 mmfor suppressing the current supply to the heating element 12 to a lowlevel.

FIG. 4 is a diagram showing a temperature variation of the circuitcomponent with respect to the distance between the heating element andthe circuit component of the electronic device according to theembodiment of the invention. In the drawing, the surface temperature ofthe circuit component 16 is measured under the same condition as in FIG.3, and there is shown how the difference ΔT2 between the highesttemperature and the lowest temperature of the circuit component 16varies in the case of varying the distance H between the heating element12 and the circuit component 16.

According to FIG. 4, in the case in which the distance H between theheating element 12 and the circuit component 16 is 0 mm, namely theheating element 12 and the circuit component 16 have contact with eachother, ΔT2 is around 20° C., but there is shown a tendency that thetemperature difference ΔT2 gradually increases as the distance Hincreases from 0.1 mm to 1.5 mm. It is conceivable that this is becausethe heat-transfer efficiency by the radiation is degraded due to theincrease in the distance between the heating element 12 and the circuitcomponent 16, and it is advantageous to dispose the heating element 12and the circuit component 16 so as to have contact with each other inorder to approximate the temperature of the circuit component 16 to thetemperature of the heating element 12, and then keep the circuitcomponent 16 at constant temperature.

FIGS. 5A through 5C are diagrams showing the temperature characteristicswith respect to the distance between the heating element and the circuitcomponent of the electronic device according to the embodiment of theinvention, wherein FIG. 5A shows the case in which the distance H is 0mm, FIG. 5B shows the case in which the distance H is 0.5 mm, and FIG.5C shows the case in which the distance H is 1.5 mm. It should be notedthat in the drawing, the frequency of the electronic device 1 at theambient temperature of 20° C. is defined as a reference frequency F0,and there is shown a value (ΔF/F0) obtained by dividing the frequencydifference ΔF between the frequency F at each of the temperature valuesand the reference frequency F0 by the reference frequency F0 is shown asthe temperature characteristics in a range of the ambient temperaturefrom −40° C. to 80° C.

According to FIGS. 5A through 5C, it is understood that the temperaturecharacteristics are sufficiently small (|ΔF/F0|≦30 ppb in thetemperature range: −40° C. through 80° C.) even with the distance H of1.5 mm although there is shown a tendency that the temperaturecharacteristics are deteriorated as the distance H between the heatingelement 12 and the circuit component 16 increases. Further, it isunderstood that temperature characteristics are smaller (|ΔF/F0|≦15 ppbin the temperature range: −40° C. through 80° C.) in a range of thedistance H of 0 through 0.5 mm.

FIG. 6 is a diagram showing a current consumption with respect to thedistance between the heating element and the circuit component of theelectronic device according to the embodiment of the invention.

According to FIG. 6, in the case in which the distance H between theheating element 12 and the circuit component 16 is 0 mm, namely theheating element 12 and the circuit component 16 have contact with eachother, the current consumption Icc of the electronic device 1 is about0.232 A. However, in a range in which the distance H is equal to orlonger than 0.1 mm, there is shown a tendency that the currentconsumption Icc once drops to take the lowest value of about 0.225 Awhere the distance H takes a value of about 0.5 mm, and then rises to avalue of about 0.237 A where the distance H takes a value of about 1.5mm.

According to the result, it turns out that the current consumption issufficiently small (not higher than 0.24 A) in a range of the distance Hbetween the heating element 12 and the circuit component 16 from 0 mm to1.5 mm, and at the same time it becomes clear that the currentconsumption takes a smaller value (not higher than 0.235 A) in a rangeof the distance H from 0 mm to 1.2 mm, and takes roughly the lowestvalue (not higher than 0.23 A) in a range of the distance H from 0.1 mmto 0.8 mm.

According to the results shown in FIGS. 5A to 5C and 6, in theelectronic device 1 according to the embodiment of the invention, bysetting the distance H between the heating element 12 and the circuitcomponent 16 to the range of not smaller than 0 mm and no larger than1.5 mm, the temperature characteristics (|ΔF/F0|≦30 ppb in thetemperature range: −40° C. through 80° C.) and the current consumption(not higher than 0.24 A) can be maintained in a preferable range.Further, by setting the distance H between the heating element 12 andthe circuit component 16 to the range of not smaller than 0 mm and nolarger than 1.2 mm, the temperature characteristics (|ΔF/F0|≦30 ppb inthe temperature range: −40° C. through 80° C.) can be maintained in apreferable state, and at the same time, the current consumption can bereduced (not higher than 0.235 A) compared to the case in which thedistance H is 1.5 mm. Further, by setting the distance H between theheating element 12 and the circuit component 16 to the range of notsmaller than 0.1 mm and no larger than 0.8 mm, the temperaturecharacteristics (|ΔF/F0|≦30 ppb in the temperature range: −40° C.through 80° C.) can be maintained in a preferable state, and at the sametime, the current consumption can further be reduced (not higher than0.23 A).

Electronic Apparatus

Then, the electronic apparatuses to which the electronic device 1according to the embodiment of the invention is applied will beexplained in detail with reference to FIGS. 7 through 9.

FIG. 7 is a perspective view showing a configuration of a mobile type(or a laptop type) of personal computer as the electronic apparatusequipped with the electronic device according to the embodiment of theinvention. In the drawing, the personal computer 1100 includes a mainbody section 1104 provided with a keyboard 1102, and a display unit 1106provided with a display section 100, and the display unit 1106 ispivotally supported with respect to the main body section 1104 via ahinge structure. Such a personal computer 1100 as described aboveincorporates the electronic device 1.

FIG. 8 is a perspective view showing a configuration of a cellular phone(including PHS) as the electronic apparatus equipped with the electronicdevice according to the embodiment of the invention. In this drawing,the cellular phone 1200 is provided with a plurality of operationbuttons 1202, an earpiece 1204, and a mouthpiece 1206, and the a displaysection 100 is disposed between the operation buttons 1202 and theearpiece 1204. Such a cellular phone 1200 as described aboveincorporates the electronic device 1.

FIG. 9 is a perspective view showing a configuration of a digital cameraas an electronic apparatus equipped with the electronic device accordingto the embodiment of the invention. It should be noted that theconnection with external equipment is also shown briefly in thisdrawing. Here, typical cameras expose silver salt films to an opticalimage of an object on the one hand, the digital camera 1300 performsphotoelectric conversion on the optical image of the object by an imagecapture element such as a CCD (a charge coupled device) to generate animaging signal (an image signal), on the other hand.

A case (a body) 1302 of the digital camera 1300 is provided with thedisplay section 100 disposed on the back surface thereof to have aconfiguration of performing display in accordance with the imagingsignal from the CCD, wherein the display section 100 functions as aviewfinder for displaying the object as an electronic image. Further,the front surface (the back side in the drawing) of the case 1302 isprovided with a light receiving unit 1304 including an optical lens (animaging optical system), the CCD, and so on.

When the photographer checks an object image displayed on the displaysection 100, and then holds down a shutter button 1306, the imagingsignal from the CCD at that moment is transferred to and stored in amemory device 1308. Further, the digital camera 1300 is provided withvideo signal output terminals 1312 and an input/output terminal 1314 fordata communication disposed on a side surface of the case 1302. Further,as shown in the drawing, a television monitor 1430 and a personalcomputer (PC) 1440 are respectively connected to the video signal outputterminals 1312 and the input/output terminal 1314 for data communicationif needed. Further, there is adopted the configuration in which theimaging signal stored in the memory device 1308 is output to thetelevision monitor 1430 and the personal computer 1440 in accordancewith a predetermined operation. Such a digital camera 1300 as describedabove incorporates the electronic device 1.

It should be noted that, as the electronic apparatus equipped with theelectronic device 1 according to the embodiment of the invention, therecan be cited, for example, an inkjet ejection device (e.g., an inkjetprinter), a laptop personal computer, a television set, a video camera,a video recorder, a car navigation system, a pager, a personal digitalassistance (including one with a communication function), an electronicdictionary, an electric calculator, a computerized game machine, a wordprocessor, a workstation, a video phone, a security video monitor, apair of electronic binoculars, a POS terminal, a medical device (e.g.,an electronic thermometer, an electronic manometer, an electronic bloodsugar meter, an electrocardiogram measurement instrument, anultrasonograph, and an electronic endoscope), a fish detector, varioustypes of measurement instruments, various types of gauges (e.g., gaugesfor a vehicle, an aircraft, or a ship), a flight simulator, mobilecommunication base station apparatus, a storage area network apparatussuch as a router or a switch, a local area network apparatus, and atransmission device for a network besides the personal computer 1100shown in FIG. 7, the cellular phone 1200 shown in FIG. 8, and thedigital camera 1300 shown in FIG. 9.

Moving Object

FIG. 10 is a perspective view schematically showing a vehicle as anexample of the moving object. The vehicle 1500 is equipped with theelectronic device 1 according to the embodiment of the invention. Forexample, as shown in FIG. 10, in the vehicle 1500 as the moving object,an electronic control unit 1510 incorporating the electronic device 1and for controlling tires 1520 and so on is installed in a vehicle body1530. Further, the electronic device 1 according to the invention canwidely be applied to an electronic control unit (ECU) such as a keylessentry system, an immobilizer, a car navigation system, a carair-conditioner, an antilock brake system (ABS), an air-bag system, atire pressure monitoring system (TPMS), an engine controller, a batterymonitor for a hybrid car or an electric car, or a vehicle posturecontrol system besides the above.

Although the electronic device, the electronic apparatus, and the movingobject according to the embodiments of the invention are hereinaboveexplained based on the accompanying drawings, the invention is notlimited to the embodiments, but the configuration of each of theconstituents can be replaced with one having an arbitrary configurationwith an equivalent function. Further, it is also possible to add anyother constituents to the invention. Further, it is also possible toarbitrarily combine any of the embodiments.

The entire disclosure of Japanese Patent Application No. 2013-092067,filed Apr. 25, 2013 is expressly incorporated by reference herein.

What is claimed is:
 1. An electronic device comprising: a resonatorprovided with a heating element; and a circuit component opposed to theheating element, and provided with at least an oscillating amplifierelement, wherein a distance between the heating element and the circuitcomponent is in a range not smaller than 0 mm and no larger than 1.5 mm.2. The electronic device according to claim 1, wherein the distancebetween the heating element and the circuit component is in a range notsmaller than 0 mm and no larger than 1.2 mm.
 3. The electronic deviceaccording to claim 1, wherein the distance between the heating elementand the circuit component is in a range not smaller than 0.1 mm and nolarger than 0.8 mm.
 4. The electronic device according to claim 1,wherein the heating element covers the circuit component in a plan view.5. The electronic device according to claim 1, wherein the circuitcomponent is provided with at least an inductor and a variablecapacitance element.
 6. The electronic device according to claim 1,further comprising: a first support section disposed on the resonator; asubstrate having the circuit component disposed, and provided with asecond support section; and a package housing the resonator and thesubstrate, wherein the first support section is connected to thesubstrate, and the second support section is connected to the package.7. The electronic device according to claim 2, further comprising: afirst support section disposed on the resonator; a substrate having thecircuit component disposed, and provided with a second support section;and a package housing the resonator and the substrate, wherein the firstsupport section is connected to the substrate, and the second supportsection is connected to the package.
 8. The electronic device accordingto claim 3, further comprising: a first support section disposed on theresonator; a substrate having the circuit component disposed, andprovided with a second support section; and a package housing theresonator and the substrate, wherein the first support section isconnected to the substrate, and the second support section is connectedto the package.
 9. An electronic apparatus comprising: the electronicdevice according to claim
 1. 10. A moving object comprising: theelectronic device according to claim 1.